Senior/Principal Digital Logic Circuits Engineer for NAND Flash

Responsibilities

• Responsible for the architecture design, RTL encoding (Verilog/SystemVerilog), and functional verification of digital control logic in 3D-NAND memory;
• Design a state machine (FSM) to manage complex NAND operation processes (such as Program, Read, Erase, Copy-back, Suspend/Resume, etc.);
• Develop a command decoder and address/parameter parsing logic to ensure compliance with JEDEC and internal specifications;
• Implement high-precision timing control logic to accurately generate the internal timing signals required for various operations (such as tR, tPROG, tBERS, etc.);
• Deeply involved in the physical layer and link layer logic implementation of ONFI (Open NAND Flash Interface) or Toggle Mode interface protocols, supporting DDR, NV-DDR, NV-LPDDR, and other modes;
• Collaborate with the analog/mixed-signal team to define array access timing, voltage switching windows, and read/write path control interfaces;
• Collaborate with firmware (FW) and system architecture teams to develop register maps, interrupt mechanisms, error handling strategies, and debug interfaces;
• Support UVM verification environment setup, provide Design for Testability (DFT) support, and participate in FPGA prototyping;
• Participate in chip bring-up, post-silicon debugging, and performance optimization to ensure products meet specification requirements.
• Required Qualifications:
• Education: Master's degree or above
• Major: Microelectronics and Integrated Circuits, Electrical Engineering, Computer Engineering, or related fields;
• Other Requirements:
• Minimum 5 years digital IC design experience, experience in NAND Flash or SSD controller projects is a plus;
• In-depth understanding of ONFI 4.x or Toggle 2.0/3.0 protocol specifications, with practical interface IP development or integration experience;
• Experience in control logic design under 3D-NAND or TLC/QLC architectures is a plus;
• Familiar with ECC control interfaces (such as LDPC/BCH engine scheduling and interaction);
• Excellent cross-functional collaboration skills, able to communicate efficiently with simulation, firmware, verification, testing, and product teams to jointly develop technical solutions.
• Experience with successfully tape-out and mass-produced memory chip projects is a plus.

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Company Intel

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