Staff Engineer, Signal Integrity - Early Career

Requirements

• Bachelor's degree in Engineering, or any other related field with 6+ years of experience; or a Master's degree or Ph.D. with 3+ years of experience with a proven track record of designs in high volume production.
• 5+ years of experience with HFSS simulations of PCB, packages and substrates for high speed interfaces (112G SerDes, PCIe Gen5)
• 5+ years of experience with DC IR drop and PDN analysis for boards with Cadence Sigrity and PowerDC.
• 5+ years of experience with layout tools like Allegro for design extraction
• Strong knowledge and expertise in high-speed RF design, photonics, and optoelectronics.
• Possesses strong fundamentals in 3D/2D EM simulation tools and transmission line theory
• Familiarity with electromagnetic compatibility (EMC) and electromagnetic interference (EMI) mitigation techniques
• Excellent communication skills, both verbal and written, to effectively collaborate with cross-functional teams and present findings to stakeholders
• Expected Base Pay Range (CAD)
• 95,700 - 127,600, $ per annum
• Additional Compensation and Benefit Elements
• All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.
• Interview Integrity
• To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
• This position may requi

Benefits

Additional Information

About Marvell Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. This is an existing vacancy. Your Team, Your Impact The Cloud Platform Optics team builds highly integrated component platforms with high-speed Silicon photonics, transmit and receive amplifiers, controller ASIC's with Marvell DSP's. These components are made operational with a highly functional embedded firmware. The team is responsible for design, verification, and validation of these integrated high speed optical components. The team performs system level testing under various operating conditions, and validates the performance of the hardware, firmware and control loops. An engineer in this team will be involved in a full product lifecycle and will carry new products from inception all the way to NPI. What You Can Expect Marvell is seeking a Signal and Power Integrity Engineer to contribute to the development of board, package, and chip designs used in optical communications. These optical interface multi-chip modules are tightly coupled with our high-performance signal processing products. The results of our innovative designs have made our products best in class for coherent long-haul and metro systems as well as PAM4 data center systems. In this role you will be responsible for driving the development and implementation of innovative signal integrity and power integrity solutions for Marvell Cloud Optics products Perform simulations for signal integrity and power integrity analysis Perform hands-on high speed signal validation and analysis verification including material, de-embedding, and component characterization. Collaborate cross-functionally with hardware design, system architecture, silicon, and layout teams to optimize signal and power integrity design based on the simulation data and measurements. Power delivery modeling, simulation, and characterization for die, package, board, and voltage regulators. Provide implementation guidelines and feedback to silicon, package, and hardware design group for electrical signal and power integrity (crosstalk, return loss, jitter, EMI, power supply noise) PCB stackup review and layer assignment for High speed and PDN Document engineering processes and procedures

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