Failure Analysis Engineer

About the role

The Failure Analysis Engineer position is a highly hands-on role dedicated to performing in-depth analysis of semiconductor integrated circuits (ICs) failures. This position is primarily based in the Failure Analysis lab, with the majority of the work involving direct lab activity. The role focuses on identifying root causes for yield excursions, new technology development issues, and reliability failures. The successful candidate will utilize precision electrical characterization tools and physical analysis techniques to determine failure mechanism and assist in root cause analysis.

Responsibilities

• Electrical Characterization (80% of Role): Perform extensive manual probing and electrical fault isolation on wafers and packaged parts. Utilize Source Measure Units (SMUs), oscilloscopes, and curve tracers to characterize electrical signatures and pinpoint anomalies.
• Physical Analysis (20% of Role): Perform targeted physical deconstruction, including mechanical polishing/grinding for cross-sections and the use of wet chemical etching and decapsulation to correlate electrical findings with physical defects.
• Advance FA techniques: Utilize advanced failure analysis techniques such as optical microscopy, SEM/EDX, FIB, OBIRCH, PEM and IR microscopy.
• Yield & Tech Development Support: Conduct in-depth analysis on wafer-level issues to identify process-related yield issues. Work closely with the technology development team to analyze failures in next-generation silicon processes.
• Reliability Analysis: Analyze devices that have failed during stress testing (REL) to understand degradation mechanisms and long-term stability.
• Collaboration & Reporting: Document findings in detailed technical reports and collaborate with Process, Design, and Yield Enhancement (DYE) teams to drive corrective actions.

Requirements

• Bachelor's or Master's degree in Electrical Engineering or Computer Engineering is required.
• Understanding of semiconductor device physics, IC fabrication processes, and packaging technologies.
• Excellent problem-solving skills and a methodical approach to root cause analysis.
• Ability to interpret complex electrical schematics and layouts.
• Strong written and verbal communication skills, with the ability to present technical information effectively.
• Ability to work independently and as part of a team in a fast-paced environment.
• Familiarity with statistical analysis tools and methodologies for data interpretation.
• Experience with programming or scripting for automation of analysis tasks.
• Knowledge of reliability testing standards (e.g., AEC-Q100, JEDEC) and failure analysis techniques and equipment is a plus.
• Experience with Allegro's specific product lines (e.g., magnetic sensors, power management ICs, motor drivers) is a plus.
• Why Allegro?
• Join Allegro and become part of a team where your contributions truly matter.
• We foster a culture of Real Innovation , empowering you to push boundaries, develop cutting-edge solutions, and drive continuous improvement.
• Your work will create a Real Impact by solving complex real-world challenges that fuel our success and shape the future of technology.
• You'll experience Real Connection , collaborating with talented colleagues around the globe in an environment built on trust, respect, and a shared purpose.
• Join us-and help build what's next.
• Eligible applicants must reside in a state where Allegro currently has an office location: This includes New Hampshire, Massachusetts, Texas, and Michigan. Certain positions (such as field sales roles) may be exempt from this requirement.

Benefits

Additional Information

The Allegro team is united by a clear purpose-advancing technologies that make the world safer, more efficient, and more sustainable. With over 30 years of experience in semiconductor innovation, we bring that purpose to life across every part of the business-from breakthrough product development and customer success to how we show up for each other and the communities we serve.

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