Optical Interconnect Process Engineer

About the role

As an Optical Interconnect Process Engineer (Glass Substrates) at OLIX, you will be responsible for translating next-generation packaging and optical interconnect architectures into scalable, manufacturable, and reliable hardware. This role focuses on the process integration, fabrication, and backend assembly of Glass Core Substrates for advanced semiconductor packaging. You will drive the development of high-density Through-Glass Vias (TGVs), panel- or wafer-level glass processing, fine-pitch metallization, and the integration of optical waveguides directly onto glass platforms. You will work hands-on across prototyping, foundry/substrate vendor transfer, characterization, and yield, ensuring our glass-based co-packaged optics (CPO) systems can be manufactured at scale with maximum signal integrity.

Responsibilities

• Optical & Electrical Interconnect Implementation
• Optimize ultra-high-density routing on glass substrates, managing the interface between high-speed electrical lines and optical pathways.
• Develop glass-to-fiber and glass-to-chip coupling solutions , leveraging the superior dimensional stability and optical transparency of glass for precision passive alignment.
• Integrate optical waveguides directly into the glass core substrate.
• Define sub-micron alignment strategies for mounting photonic integrated circuits (PICs) and ASICs onto glass panels.
• Advanced Packaging & Integration
• Drive co-packaged optics (CPO) and panel-level packaging (PLP) architectures utilizing advanced glass cores.
• Address opto-mechanical constraints , taking advantage of glass's tailorable CTE to match silicon and minimize thermal stress.
• Partner with mechanical and thermal teams to manage structural integrity, warpage control, and heat dissipation across large-body glass packages.
• Process Development & Manufacturing
• Develop and refine panel/wafer-scale processes for Glass Core Substrates, focusing on Through-Glass Via (TGV) formation via laser-assisted etching, mechanical drilling, or chemical processes.
• Optimize high-aspect-ratio TGV metallization (seed layer deposition, copper electroplating, and chemical mechanical planarization) to ensure void-free electrical connections.
• Establish robust dielectric buildup and multi-layer lithography processes on glass surfaces.
• Partner with tier-1 glass vendors, substrate manufacturers, and OSATs to transfer, stabilize, and scale GCS process flows from R&D to high-volume manufacturing.
• Yield, Reliability & Validation
• Mitigate glass micro-cracking, stress concentrations, and delamination through optimized annealing, surface passivation, and adhesion-layer engineering.
• Analyze process-induced warpage and dimensional variation across large-format glass panels (e.g., 515mm x 510mm or larger).
• Define and execute rigorous reliability testing (thermal cycling, mechanical shock, drop testing) to validate the structural and optical integrity of glass packages in data center environments.

Requirements

• 5-15 years of experience in advanced semiconductor packaging, substrate manufacturing, or micro-machining, with a strong focus on Glass Substrates, Panel-Level Packaging (PLP), or advanced interposers.
• Proven track record of developing or scaling complex fabrication flows involving brittle materials, glass handling, or high-density substrates.
• Deep technical understanding of Through-Glass Via (TGV) formation technologies (e.g., Laser-Induced Deep Etching/LIDE, laser ablation) and subsequent metallization chemistry.
• Experienced collaborating with external substrate suppliers , glass foundries (e.g., Corning, Schott), R&D consortia, or OSATs to deploy new packaging capabilities.
• Comfortable switching between hands-on lab characterization (failure analysis, stress profiling) and high-level vendor management.
• Proficient in DOE/SPC tools (JMP, Python, etc.) and disciplined process documentation.
• B.Eng./ M.Sc ./Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related field.
• Excellent communicator who excels in fast-paced, interdisciplinary hardware teams.
• Experience with ion-exchange (IE) waveguide fabrication inside glass or direct laser writing.
• Background in material interface engineering , specifically enhancing metal-to-glass adhesion.
• Compensation & Equity
• Competitive Salary: Commensurate with your experience, skills, and location
• Equity & Ownership: Meaningful stock options. You're not just joining the mission; you're owning a piece of it
• Proximity Bonus: We value your time. To minimise your commute and maximise your life, we offer an annual Living-Local Bonus if your residence is within 20 minutes of the office
• Retirement Benefits: Employer-contributed retirement plans to help you build long-term financial security.
• Due to U.S. export control regulations, candidates' eligibility to work at OLIX depends on their most recent citizenship or permanent residency status. We are generally unable to consider

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