Technician 2, Manufacturing Equipment (Die Prep)
External
Sandisk · Batu Kawan, MalaysiaPrepare for this interview
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Requirements
- Able to do troubleshooting and maintenance at Die Prep equipment, hands on and provide systematic problem analysis.
- Able to perform Preventive maintenance, conversion. and quality improvement projects.
Additional Information
ESSENTIAL DUTIES AND RESPONSIBILITIES: Be responsible for Die Prep equipment day to day line sustaining, PM and conversion. Able to hands on and provide systematic problem analysis. Ability to troubleshoot, analyze complex problems and 5 WHY analysis. Be available for overtime work as of when needed. Experience in PM and major down troubleshooting. Responsible to liaise with process engineering team for low yield triggering. REQUIRED: Certificate / Diploma in Electrical & Electronic / Mechatronic or Equivalent. 1~3 years of equipment engineering experience in Wafer soft test equipment maintenance. PREFERRED: Knowledge in Backgrind, wafer saw and Taping will be added advantage. Die Prep equipment maintenance and troubleshooting skill, wafer handling skill and involve in some improvement project.
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