Senior Packaging Engineer, Silicon Photonics

About the role

nEye.ai, a well-funded optical switch startup, is poised to revolutionize the future of data centers. nEye's MEMS-based silicon photonics optical circuit switches (OCS) eliminate critical bottlenecks in AI processing by enabling direct optical connections among thousands of GPUs and memory units. The company's SuperSwitch is an ultra-low power consumption, high radix, compact chip-scale design, offering hyperscale data centers enhanced performance, efficiency, and scalability. Job Overview: This role is for a highly skilled and experienced Packaging Design Engineer to own bump-bond, die-attach, adhesive, and fiber-attach for our next-generation silicon photonics packaging solutions. You will be the designer of our product-critical packaging designs, ensuring high performance and exceptional reliability. You will own the details of the assembly, from the collaborative design of the electrical, optical and mechanical structures to process definition, with a focus on design for manufacture and design for reliability. This is a hands-on technical position requiring a deep understanding of precision optical assembly. You will work closely with other packaging engineers, as well as integrated circuit (IC) design, mechanical, and reliability teams to create robust, manufacturable packaging solutions. Your expertise will be vital for pushing the boundaries of fiber-to-chip coupling efficiency, mechanical stability, and long-term product reliability. You will maintain the controlled documentation for every interface in the package - materials, surface preparations, critical process steps, thermal budgets, and the rationale for each - and defend those choices in design reviews with data. You define the design intent - geometries, materials, tolerances, and the rationale behind them - and partner with process engineers who develop the recipes and equipment settings to realize your designs in production. nEye.ai is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law.

Requirements

• Bachelor's, Master's, or Ph.D. in Mechanical Engineering, Electrical Engineering, Materials Science, Optical Engineering, or a related field.
• 5+ years of hands-on experience in packaging design for optical or photonic components with demonstrated ownership of released package designs in production.
• Demonstrable experience with optical interfacing to PICs, including proficiency with active and passive alignment techniques.
• In-depth knowledge of packaging materials - including optical adhesives and epoxies - their design constraints, and their use in high-reliability applications.
• Deep knowledge of semiconductor fabrication processes and how they constrain package design.
• Proven ability to work with OSATs and contract manufacturers to design, implement, and transfer designs to volume production.
• A strong understanding of reliability engineering principles, including failure mechanisms related to packaging, and experience with relevant testing standards (e.g., Telcordia).
• Excellent problem-solving skills and a track record of driving complex technical challenges from concept to solution.
• Fluency in tolerance stack-up analysis and GD&T; able to defend a stack-up across optical, mechanical, and thermal domains.
• Experience with CAD tools for mechanical design and packaging layouts.

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