EDE-SG Equipment Development Senior Engineer/Engineer (Dry Etch)

Responsibilities

• Set up equipment and/or CIP hardware for evaluation by the process development team. This enables early introduction (EFMEA), maturity (EMI), and adoption of both current and next-generation 3D NAND nodes.
• Work with the Fab layout and facility team to ensure flawless installation and operation of the equipment.
• Work together with the process development team to measure the benefits of equipment/CIP hardware.
• Develop and optimize existing equipment hardware to meet the efficiency requirements of advanced 3D NAND parts.
• Engage with equipment development peers on technology choices for upcoming nodes and translate future technology needs into clear equipment requirements.
• Identify exciting equipment early and work with manufacturing to determine viable evaluation paths forward.
• Build and implement advanced equipment monitoring and control methodologies.
• Lead teams or suppliers on complex projects in focused meetings to mature equipment technology in record times for technical advantage, cost, and efficiency.
• Serve as a technical expert within Micron, providing advice and recommendations to senior management on improvements from equipment development. Lead and initiate innovation projects through patents and technical papers.
• Identify and resolve safety hazards; follow strict safety procedures including lockout, chemical safety, lifting techniques, and ergonomically accurate methods.

Requirements

• Bachelor's or Master's Degree in Mechanical, Chemical, Electrical/Electronic, or Material Science along with no less than 3 years of relevant experience, or a PhD in Mechanical, Chemical, Electrical/Electronic, or Material Science.
• In-depth understanding of dry etch equipment operation, working principles, troubleshooting, and tool installation procedures
• Exposure to R&D dry etch equipment transfer and the ability to develop/optimize equipment hardware design is preferred
• Exposure to Dry Etch pump/abatement/chiller selection and ability to develop/optimize equipment hardware design is preferred
• Maintain and publish roadmaps to define work/CIP's required to move toolsets from one EMI level to the next in preparation for transfer to HVM.
• Remarkable oral and written communication skills, demonstrating the ability to express messages clearly and effectively on a local and global scale.
• Proven ability to prioritize and manage multiple projects simultaneously, efficiently applying available resources or seeking peers' and/or management help to drive solutions.

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Company Intel

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