Hybrid Bonding Equipment Development Director
External
Achieve · SingaporeFull-timeHybrid1w ago
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About the role
Job Responsibilities Lead local Hybrid Bonding equipment full-cycle R&D, architecture design, technical breakthrough and iteration. Connect with local & Southeast Asian OSAT/wafer fabs, match HBM, Chiplet, 3D stacking process demands, deliver technical solutions. Oversee precision mechanism, nano alignment, motion control, vacuum & temp-pressure control, electrical and software system integration & debugging. Complete prototype tuning, accuracy optimization, yield improvement and customer accep...
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