Principal Engineer, Packaging Engineering

Requirements

• Strong troubleshooting and analytical skills with the ability to collect, organize, analyze, and understand problems and conceptualize solutions.
• Passion, determination to uncover the root cause and derive a long-term solution, using quality tools such as FMEA, 8D, MBPS, DMAIC.
• Excellent communication and collaboration skills.
• Good at mind mapping and proficient in MS Excel, MS Project, and PowerPoint presentation.
• Understanding of SQL query writing (Oracle / Microsoft SQL Server) and JMP is a plus.
• Ability to communicate with different hierarchy levels from diverse geographical areas and cultures.
• Strategically focused, impact-oriented, highly organized, and adaptable.
• Exposure to Industry 4.0 technologies, real-time dashboards, or digital transformation initiatives in manufacturing.

Additional Information

ESSENTIAL DUTIES AND RESPONSIBILITIES: Develops and leads SiP (System in Package) assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements. Leads new package and SMT/Flip Chip/Underfill process qualification programs. Develops and maintain process documentation, including standard operating procedures and work instructions. Plans and conducts experiments to fully characterize material and processes throughout pathfinding to development to ramp. Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity utilizing statistical knowledge, and problem-solving tools. Establishes process control systems. Transfers process to high volume manufacturing and provide support in new factory start-up. Acts as a liaison with suppliers/vendors. Maintains product quality while developing and introducing package cost reduction programs. Coordinates and leads the introduction of new package processes into production. Collaborate with cross-functional teams to lead FC team to drive continuous improvement projects. Collaborate closely with process, equipment, factory automation and IT teams to deliver robust and efficient automation solutions. REQUIRED: Bachelor/Master/PhD engineering/material/science required plus min 8 years of relevant work experience, min 5 year for PhD. Relevant work experience must be in engineering role within semiconductor industry. Academic studies must be in applicable field of engineering/science and demonstrate an academic record of excellence. PREFERRED: Track record of AI/ML experience is added advantage. Proficiency in statistical data analysis and process simulation software. Demonstrated track record to pathfinding and development new SMT/FC/UF material such as paste and epoxy with vendors and utilizing test methodology to qualify new material in factory. Demonstrated track record to rapidly analyze and solve complex engineering issues by pursuing a focused solution path with a clear understanding of technical fundamental on root causing thru failure analysis report (EDX/FTIR etc), simulation report, mechanical (shadow moire) analysis report, or any relevant metrology data collection. Strong attention to detail and commitment to achieving goals. Ability to adapt to changing priorities and work efficiently in a fast-paced environment.

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Company Intel

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