Senior NPI Engineering Program Manager I (SMT Process)

Responsibilities

• Reports to: Director, NPI Engineering Direct Reports: None
• The role requires up to 30% travel to CM sites across Southeast Asia. Success is measured by first-pass SMT yield, build schedule adherence, CM process qualification status, and reduction in board-level escapes across NPI phases.
• Plan and execute contract-manufacturer PCB assembly builds through Axon Product Lifecycle gates (SP, EVT, DVT, PVT) with clear SMT readiness metrics and exit criteria
• Lead DFM/DFA reviews with electrical design teams, focusing on board layout, component placement, land pattern design, panelization, and solderability
• Drive solder paste, reflow, wave, and selective solder process qualification at CM sites
• Specify and validate CM equipment, stencil design, and material selection (paste, flux, PCB surface finish)
• Interpret and act on SPI, AOI, AXI, and ICT data to identify and resolve process escapes before they impact yield
• Perform board-level failure analysis: solder joint characterization, cross-sectioning, delamination, pad cratering, and component failure modes
• Plan and execute DOEs for reflow profile optimization, underfill, conformal coat, and other SMT processes; confirm process capability
• Monitor yield and process capability with SPC; trigger and drive corrective actions from data trends
• Challenge CM yield data and root cause analyses; drive to verified fixes rather than accepting first answers
• Develop and maintain PFMEA, control plans, and process flow documentation for PCB assembly operations
• Support IPC standards compliance (IPC-A-610, J-STD-001, IPC-7711/21) at CM sites
• Close build readiness actions across SMT process, equipment, materials, and quality at each build phase
• Deliver concise build summaries, yield analyses, and technical updates to engineering, operations, and executive teams

Requirements

• B.S. in Electrical Engineering, Electronics Engineering, or related engineering discipline; 8+ years of relevant experience
• 5+ years in SMT process engineering within an NPI or high-mix electronics manufacturing environment
• Demonstrated PCB assembly ramps with Southeast Asia contract manufacturers (reflow, wave/selective solder, BGA, fine-pitch components)
• Hands-on experience with SPI, AOI, AXI, and ICT interpretation and process response
• Board-level failure analysis: solder joint characterization, cross-sectioning, delamination, pad cratering, component failure modes
• DFM/DFA reviews for PCB layout, component

Benefits

Additional Information

Join Axon and be a Force for Good. At Axon, we're on a mission to Protect Life. We're explorers, pursuing society's most critical safety and justice issues with our ecosystem of devices and cloud software. Like our products, we work better together. We connect with candor and care, seeking out diverse perspectives from our customers, communities and each other. Life at Axon is fast-paced, challenging and meaningful. Here, you'll take ownership and drive real change. Constantly grow as you work hard for a mission that matters at a company where you matter.

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