Process & Equipment Engineers

Responsibilities

• As the technical owner for Die Bond or Wire Bond processes, you will:
• Ensure stable and efficient operation of manufacturing equipment and processes.
• Monitor and improve equipment uptime, Overall Equipment Effectiveness (OEE), yield, and product quality.
• Set up, calibrate, qualify, and optimize production equipment and tooling.
• Troubleshoot process and equipment issues using structured problem-solving methodologies.
• Apply engineering tools such as DOE, FMEA, SPC, and Root Cause Analysis to solve complex manufacturing challenges.
• Analyze manufacturing data, identify trends, and implement improvements using tools such as Excel, Power BI, Spotfire, or similar platforms.
• Lead and support New Product Introduction (NPI), product conversions, and material qualifications.
• Develop and optimize bonding parameters to improve process capability and manufacturing robustness.
• Drive automation, digital controls, recipe management, and poka-yoke solutions to prevent defects and improve reliability.
• Partner closely with Production, Quality, Product Engineering, and Design teams to achieve operational excellence.
• Create technical documentation, SOPs, and troubleshooting guides.
• Train and mentor technicians and operators to build strong technical capability across the production floor.
• Lead continuous improvement projects focused on productivity, cost reduction, and quality enhancement.

Requirements

• Bachelor's Degree in Mechanical Engineering, Electrical Engineering, Electronics Engineering, Mechatronics, or a related field.
• 2-3 years of experience in semiconductor backend manufacturing, preferably in Die Bond and/or Wire Bond processes.
• Hands-on experience with equipment setup, troubleshooting, calibration, and process optimization.
• Understanding of yield improvement, process capability (Cpk), and manufacturing KPIs.
• Experience using structured problem-solving tools such as DOE, FMEA, SPC, 8D, or similar methodologies.
• Strong analytical skills and the ability to work with manufacturing data.
• Experience supporting New Product Introduction (NPI) and qualification activities.
• Excellent communication and teamwork skills.
• A proactive mindset, curiosity to learn, and a passion for continuous improvement.
• Bonus Points If You Have
• Experience in Reel-to-Reel (R2R) assembly processes.
• Knowledge of Power BI, Spotfire, SQL, Python, or automation tools.
• Experience implementing digital manufacturing controls or Industry 4.0 initiatives.
• Exposure to automotive or high-reliability semiconductor products.
• Who Will Thrive in This Role?
• You're someone who:
• Loves understanding how machines work and how to make them perform better.
• Enjoys solving technical problems using both data and hands-on investigation.
• Wants ownership and visibility for the projects you deliver.
• Is excited by fast-paced manufacturing environments where every improvement matters.
• Sees challenges as opportunities to innovate.
• Why Join Us?
• Work with advanced semiconductor assembly technologies
• Drive real improvements in yield, quality, automation, and productivity
• Gain exposure to New Product Introduction (NPI) and industrialization
• Collaborate with experts across Engineering, Quality, Manufacturing, and R&D
• Develop skills in data analytics, process optimization, and Industry 4.0 tools
• Build your career in one of Malaysia's fastest-growing high-tech industries
• Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
• D&I Statement
• In addition, we offer our colleagues the possibility to join employee resource group

Benefits

Additional Information

Ready to launch your engineering career? We're growing rapidly and have multiple openings for talented engineers who want to work with advanced semiconductor technologies and make a real impact from day one. Join our Semiconductor Assembly Engineering team and take ownership of some of the most critical processes in advanced semiconductor manufacturing. As a Process & Equipment Engineer , you will work directly with state-of-the-art Die Bond and Wire Bond equipment in a high-volume Reel-to-Reel (R2R) production environment, driving yield improvements, equipment performance, and next-generation product introductions. This is an excellent opportunity for engineers who enjoy hands-on technical work, data analysis, continuous improvement projects, and making a visible impact on manufacturing performance.

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