High-Power Packaging Engineer

Requirements

• BS or MS degree in Mechanical, Material Science, Electrical Engineering or related engineering degree
• 3+ year of experience in design of high voltage/high power packages and modules across MOSFET, IGBT, SiC, GaN technologies.
• Proficiency in CAD software, SolidWorks / Auto CAD preferred.
• Knowledge in various packaging technology, process flow, material, qualification and manufacturing implementation.
• Knowledge in high voltage/high power package reliability requirements, failure analysis techniques, assembly process issues, etc.
• Thermal, electrical, stress simulation skills are a plus.
• Strong communication, presentation, and interpersonal skills.
• Problem-solving mindset.

Additional Information

Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. We are worldwide technical leaders in Integrated Power Semiconductors and Systems Power delivery architectures. At MPS, we cultivate creativity, are passionate about sustainability, and are committed to providing leading-edge products and innovation to our customers. Our portfolio of technology helps power our world ---come join our team and see how YOU can make a difference. Job Description: The Day-to-Day Design, develop and scale to volume production of high voltage/high power packages and modules for the industrial, automotive, renewable and telecom markets. The candidate can understand system requirements and build these into the definition of the package to meet electrical, thermal, and mechanical specifications. The candidate can identify prototype/subcon partners, assess manufacturing capabilities and drive completion of 1st article builds. The candidate can be capable of developing new process flows/technologies necessary for building prototypes. The candidate can outline the package reliability plans, complete testing, summarize failure modes and identify fixes via or design and material selection. The candidate must have a broad knowledge of the package materials (molding compound, die attach, substrate etc) for high voltage/high power packages and modules.

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