Photonic Packaging Engineer

Responsibilities

• Design, Develop and Support
• Provide engineering support for Cisco's internally developed photonic assembly packaging tools.
• Gather and analyze data from Cisco's automated packaging tools/processes to shape new projects targeting improvement in novel subassemblies used in Cisco-designed high-volume manufacturing platforms.
• Recommend and implement test/assembly/process improvements, including cycle time reduction and automation of system to minimize required operator time and intervention.
• Design, build, and test prototypes of critical, complex electromechanical assemblies to be used in automated manufacturing/test tools.
• Diagnostics Development & Lifecycle Management
• Follow new tools, processes, and components from development to production to ensure successful integration of new platform technologies.
• Apply analytics and AI/ML to stimulate edge cases, optimize strategies, improve coverage, usability, debug capabilities and problem detection using structured problem-solving methodologies.
• Collaboration & Team Development
• Partner with hardware, software, and manufacturing teams to ensure multi-functional alignment and successful transition to manufacturing.
• Develop and execute project plans with predictability, quality and velocity.
• Collaborate and travel to assure successful product deployment across a global environment
• Mentor and develop high-performing teams, emphasizing continuous learning in diagnostics, data engineering, advanced analytics, and effective use of AI-assisted development tools.

Requirements

• Bachelors + 7 years of related experience, or Masters + 4 years of related experience, or PhD + 1 year of related experience
• Hardware/process automation experience
• Experience in hardware/software automation of photonics assembly/test.
• Experience with machine vision in an automation environment.
• Data analysis (SQL/JMP) in a semiconductor production environment
• Software development using C# on .NET
• Knowledge of photonics, fiber optics and semiconductor lasers
• Why Cisco?
• We are Cisco, and our power starts with you.
• Message to applicants applying to work in the U.S. and/or Canada:
• The starting salary range posted for this position is $134,300.00 to $195,400.00 and reflects the projected salary range for new hires in this position in U.S. and/or Canada locations, not including incentive compensation*, equity, or benefits.
• U.S. employees are eligible for paid time away as described below, subject to Cisco's policies:
• 10 paid holidays per full calendar year, plus 1 floating holiday for non-exempt employees
• 1 paid day off for employee's birthday, paid year-end holiday shut

Benefits

Additional Information

The application window is expected to close on: 05/01/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received . This is an onsite role and will require working out of our Carlsbad, CA office location. Meet the Team As a Photonic Packaging Engineer, you will play a key role in developing/supporting the next generation packaging platform for Cisco's Silicon Photonics Integrated Circuits and chipsets. You'll have the opportunity to work as a key member of the platform development team that is responsible for developing critical optical components, processes, and tools.

Your Match

How well this role fits your profile.

Company Intel

What employees say

Worked at Cisco? Share your experience