Silicon Photonics Packaging Technical Leader- (Hybrid)

Responsibilities

• As a Packaging Technical Leader, you will be responsible for the development and qualification of advanced packaging solutions for Cisco's next generation optical transceiver products.
• Serve as the primary technical interface for the Client Optics Group with top-tier Outsourced Semiconductor Assembly & Test (OSAT) driving advanced package assembly, test, and qualification for silicon photonics products.
• Lead the design and layout of test vehicles to validate packaging processes; conduct rigorous design reviews for complex substrates, ensuring alignment with signal/power integrity requirements and manufacturing capabilities.
• Cross-functional technical leadership to proactively identify and mitigate risks, resolve highly complex assembly issues, and establish best-in-class quality and reliability standards across the supply chain.
• Work collaboratively with other internal teams to influence package architecture and provide expert guidance on DfM, DfR, contributing to the definition of critical process parameters for HVM. Engage deeply in substrate design, materials selection, and reviews.
• Present technical findings and recommendations to cross-functional teams and stakeholders.
• Stay informed on emerging packaging technologies and industry trends, contributing to the evaluation of new materials, processes, and architectures.

Requirements

• Proven experience in advanced Silicon Photonic package technology development, such as 2.5D/3D integration, TSV, flip-chip, stacking, hybrid integration, wafer-level packaging, and package technology qualification methods
• Prior experience of package design & architecture, including substrate design and chip fabrication.
• Experience with advanced substrate manufacturing processes and materials and their impacts to device level signal and power integrity
• Experience with industry-standard design and simulation software (e.g., Cadence, klayout, Ansys or similar tools).
• Prior experience to work within and lead projects with highly cross-functional and geographically distributed technical teams.
• Experience with co-packaged optics is a plus
• Experience with volume manufacturing
• Experience with mechanical and thermal modeling and simulation software
• Experience in advanced problem-solving methodologies (e.g., 8D, FMEA, statistical process control) and data analysis skills.
• Why Cisco?
• We are Cisco, and our power starts with you.
• Message to applicants applying to work in the U.S. and/or Canada:
• The starting salary range posted for this position is $148,800.00 to $212,900.00 and reflects the projected salary range for new hires in this position in U.S. and/or Canada locations, not including incentive compensation*, equity, or benefits.
• Individual pay is determined by the candidate's hiring location, market conditions, job-related skillset, experience, qualifications, education, c

Benefits

Additional Information

The application window is expected to close on: 06/30/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received . This is a hybrid role with two days per week at Cisco's Carlsbad or Allentown office. Meet the Team The Common Hardware Group (CHG) creates innovative hardware platforms central to the AI era, powering Cisco's core Switching, Routing, and Wireless products for organizations globally. Our innovations in silicon, optics, and hardware platforms-like Silicon One-are shaping the technology industry. We're a global team of creative experts, bringing our unique backgrounds and bold ideas to push boundaries and help each other grow. Because full product development-from design to qualification to production-is within our team, we're able to think differently, experiment more, and work quickly. Join us to power the future of the digital world.

Your Match

How well this role fits your profile.

Company Intel

What employees say

Worked at Cisco? Share your experience