Senior Engineer, Packaging Engineering (Thermal Design)

Requirements

• Strong oral and written communication skills.
• Demonstrated strong work ethic.

Additional Information

ESSENTIAL DUTIES AND RESPONSIBILITIES: As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level. The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques. The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments. REQUIRED: B.S. in Mechanical Engineering plus 5 years, of relevant industry experience Solid knowledge through academic coursework or experience required in Mechanical design Proficiency in CAD software (e.g. SolidWorks, Autocad) Knowledge of engineering drafting standards and tolerance analysis A strong background in mechanical design with electronic consumer product design a plus Knowledge of plastic injection molding and metal fabrication Demonstrated strong work ethic Prior history working with outside suppliers and contract manufacturers Ability to work in a team environment and interact with others to release products on schedule Prior retail packaging design a plus

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Company Intel

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