Principal/Staff Engineer, PCVD Film Deposition, TD

Responsibilities

• Develop and optimize advanced thin film deposition processes (ALD, LPCVD, PECVD, PVD) for cutting-edge device architectures
• Design and execute complex DOE experiments to improve process capability, uniformity, and reliability
• Perform in-depth root-cause analysis using advanced modeling and characterization techniques
• Collaborate with integration, other process areas, metrology, and equipment engineering teams to solve critical technical challenges
• Drive innovation in film deposition for improved performance, cost efficiency, and sustainability
• Utilize advanced data analytics and modeling to predict process behavior and accelerate development cycles
• Define technology roadmaps and lead strategic research initiatives. Generate intellectual property and influence future deposition technology directions
• Mentor junior engineers and lead multi-disciplinary technical projects
• Artificial Intelligence
• Using, applying and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision making across projects and teams

Requirements

• Education:
• Ph.D / Master's in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related field
• Master with minimum 8 years or PhD with minimum 5 years hands-on experience in advanced thin film deposition, characterization or related semiconductor field
• Core Technical:
• Expertise in ALD, LPCVD, PECVD, and PVD for advanced nodes
• Strong understanding of film growth mechanisms, surface chemistry, and plasma physics
• Knowledge of thermodynamics, chemical kinetics, and reaction engineering
• Analytical & Modeling:
• Proficiency in DOE, SPC, and advanced statistical analysis
• Some Familiarity with TCAD or process simulation tools for film modeling
• Data analytics and machine learning for process optimization
• Characterization:
• Hands-on experience with TEM, SEM, XPS, SIMS, XRD, AFM, ellipsometry, and other thin film metrology
• Problem-Solving:
• Advanced root-cause analysis and failure mode identification
• Ability to develop predictive models for process behavior

Additional Information

Job Summary We are seeking a highly motivated engineer to join our Technology Development team focused on advanced thin film deposition processes for next-generation memory technologies. This role spans responsibilities from process development to technical leadership, depending on experience level (Principal/Staff).

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Company Intel

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