Design, develop, and qualify packaging solutions and materials that meet product, regulatory, and environmental requirements.
Lead packaging development efforts, including creating artwork, prototypes, and detailed specifications.
Collaborate with cross-functional teams to ensure packaging solutions align with manufacturing, logistics, and supply chain needs.
Identify and implement cost-saving measures and processes to enhance efficiency, reduce waste, and promote sustainability.
Conduct risk analyses to ensure compliance with regulations and Intel's high-quality standards.
Partner with cross-organizational teams on SKUs, labeling, branding, and bills of material for product distribution.
Evaluate and qualify vendors to ensure scalability and high-quality manufacturing of packaging solutions.
Technical knowledge and firsthand experience are critical for effective integration of cross functional efforts including Assembly Process technology, Package assembly Design Technology, design services, statistical model-based analysis and Yield and package reliability analysis
Engages with customer and Drives programs to satisfy foundry customer needs.
-Create and maintain detailed technical specifications to ensure consistent and clear documentation.
Behavioral Skills:
Strong communication and collaboration skills with the ability to work effectively across internal teams, vendors, customers, and cross-functional stakeholders.
Strong analytical and problem-solving skills.
Ability to manage multiple priorities in a fast-paced technical environment.
Demonstrated ability to research, develop, and drive innovative technical solutions.
Strong organizational and documentation skills.
Requirements
Bachelor's degree in Engineering, Material Science, Physics, Chemistry, or a related technical field.
6+ years of experience with a Bachelor's degree, 2+ years with a Master's degree, or a PhD with relevant academic/research experience in semiconductor industry processes, semiconductor packaging, optics, or optical packaging technologies.
Additional Qualifications for Consideration:
Knowledge of Design for Manufacturing (DFM) principles.
Experience with semiconductor packaging assembly and production processes.
Experience with optical packaging technologies and semiconductor manufacturing environments.
Experience performing data analysis, statistical analysis, yield analysis, or package reliability analysis.
Experience working in cross-functional engineering and manufacturing environments.
Join our team and make an impact on Intel's packaging innovation and sustainability efforts. Apply now to shape the future of technology and leave your mark on a global scale.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
US, Oregon, Hillsboro
Business group:
Posting Statement:
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks amon
Additional Information
Job Details:
Job Description:
The Role and Impact
As a Product Packaging Engineer, you will be at the forefront of designing and developing innovative packaging solutions that accelerate Intel's product delivery to a global customer base. This role places you at the intersection of engineering innovation and sustainability, ensuring Intel's products are safely transported while minimizing environmental impact. You will collaborate across diverse teams, including manufacturing, regulatory, logistics, and supply chain, to meet operational goals and drive continuous improvement. Your contributions will directly influence Intel's ability to deliver high-quality products efficiently, making you an essential part of our mission to shape the future of technology.
Intel · Arizona, Phoenix