Senior Engineer, Semi Packaging Engineering

Requirements

• Ph.D or Master's degree in degree in Mechanical or Material, or Electrical engineering required.
• Relevant experience in wafer-level package development, process, equipment, qualification and manufacturing implementation.
• Knowledge of package reliability requirements, failure analysis techniques, assembly process issues, etc.
• Knowledge on Ansys or Flotherm a plus.
• EEO is the Law: Notice of Applicant Rights Under the Law .
• Job Req Type: Graduate Job
• Required Travel: Yes, 10% of the time
• The expected wage range for a new hire into this position is $95,600 to $131,450. Actual wage offered may vary depending on work location , experience, education, training, external market data, internal pay equity, or other bona fide factors.
• This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
• This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time , and other benefits.

Benefits

Additional Information

Come join Analog Devices (ADI) - a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality and remote healthcare. ADI fosters a culture that focuses on employees through beneficial programs, aligned goals, continuous learning opportunities, and practices that create a more sustainable future. About Analog Devices Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X . We are looking for a highly motivated Packaging Engineer who can develop and manage Wafer Level Packaging technologies on several platforms. As a WLP engineer, you will support ADI's Worldwide Business Units and Customers and engaging with subcontractors/OSATs at South East Asia. Responsibilities included but not limited to: Develop/Qualify competitive Wafer-Level Packaging solutions to support new product integration. Partner with Business Units, Designers, and Marketing to define requirements of new products; Maintain clear understanding of product requirements and manage product-package development at subcontractors/OSATs. Work closely with Quality/Reliability groups to qualify packages and ensure design-for-manufacturability and design-for-reliability. Review & Manage process changes at subcons that impact product performance and drive cost competitive solutions. Review of production metrics and monitor process capability data (Cpk) at subcons.

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