Skip to main content
Process Development Engineer (Wire bond Package R&D) at Nexperia
Provide technical input for assembly processes and equipment solutions for new products and platforms
Lead technical discussions and troubleshooting on wire bond and related FOL processes across project teams and sites
Apply wafer metallization knowledge to optimize process performance and stability
Conduct benchmarking and technology studies to support package roadmap and continuous improvement initiatives
Use statistical analysis tools (e.g. Minitab/Statistica) to analyze process performance and drive data-based decisions
Provide technical support for wire bond-related issues for both internal and external customers
Demonstrate technical leadership in cross-site problem solving and process improvement activities
Communicate effectively across teams, ensuring clear technical alignment and fast response to manufacturing challengesRequirements Bachelor's degree in engineering or an equivalent related field of study At least 5 years of experience in semiconductor or manufacturing environment Hands-on experience in FOL processes (wafer dicing, die bond, plasma, wire bond, AOI) Strong knowledge of wire bond packaging technologies Experience applying Six Sigma methodologies and statistical tools (DOE, SPC, FMEA, 8D, Minitab/Statistica) Strong analytical, problem-solving, and data interpretation skills Good communication skills in fluent English Strong teamwork, interpersonal skills, and ability to work across functions and sites Strong ownership, responsiveness, and ability to handle customer or production issues effectively Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark. D&I Statement In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.Additional Information As a Process Development Engineer (WB), you will develop and optimize semiconductor assembly processes to meet project Functional Requirement Specifications (FRS), ensuring robust manufacturability, reliability, and high-quality output for new products and platforms.
Your Match How well this role fits your profile.
Interested in this role? Apply on the company's website.