Collaborative Research Leadership: Leads the design, execution, and analysis of precise thermal measurements for advanced semiconductor devices while ensuring methodologies align with broader team goals and doctoral-level rigor.
Integrated System Assembly: Collaborates with laboratory staff to assemble and integrate complex cooling systems, experimental racks, and thermal sensors, including the shared troubleshooting of hardware configurations.
Software & Automation Support: Develops and maintains custom data acquisition and equipment control software (e.g., LabVIEW, Python) to automate experimental procedures and ensure high-fidelity data capture for the entire research team.
Team Microfabrication Support: Executes advanced packaging and microfabrication processes in partnership with fabrication specialists to support ongoing Heterogeneous Integration (HI) initiatives.
Cross-Functional Model Validation: Provides critical empirical thermal data to simulation engineers to validate, troubleshoot, and refine computational models, working collectively to resolve complex engineering discrepancies.
Team Communication & Reporting: Interprets and presents highly technical R&D findings during team briefings and to external stakeholders, translating academic research into actionable strategies for the multidisciplinary group.
Work Environment:
Location: On-site at AFRL, Wright-Patterson AFB, Oh
Travel Requirements: Minimal 0-20%
Working Hours: Standard
Required:
Education: Bachelor's degree in electrical engineering, mechanical engineering, materials science, or a closely related physical science/engineering field with 6-10 years' experience.
Technical Proficiency: Demonstrates expertise in programming for laboratory equipment automation and data acquisition (e.g., LabVIEW or Python), alongside strong empirical research and data analysis capabilities.
Security Clearance: Must possess the ability to obtain and maintain a U.S. Government
Desired:
Academic & Collaborative Record: Maintains a strong track record of peer-reviewed publications or technical reports, particularly those demonstrating successful collaboration in research environments.
Advanced Simulation Awareness: Possesses experience with thermal simulation and modeling software such as ANSYS Icepak, COMSOL, or FLOTHERM, and the ability to work effectively with simulation specialists.
Cleanroom Experience: Demonstrates hands-on experience with semiconductor fabrication, cleanroom environments, or advanced packaging techniques within a team-based laboratory.
Problem Solving & Team Orientation: Exhibits high levels of self-motivation and the ability to solve open-ended research questions while maintaining a strong commitment to team-wide success.
Interpersonal Communication: Possesses exceptional written and oral communication skills, with a proven track record of effective collaboration and knowledge sharing within multidisciplinary teams.
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Additional Information
Title:
Electrical Engineering Researcher
KBR is seeking a dedicated Electrical Engineering Researcher to join a multidisciplinary Research & Development (R&D) team within the Air Force Research Laboratory and lead the thermal measurement and physical assembly of advanced microelectronics systems . Working as a collaborative member of the research staff, the successful candidate is responsible for designing and conducting highly precise thermal measurements of microelectronic components utilizing infrared cameras and dedicated thermal sensors. This role requires a hands-on approach in a shared laboratory environment, where the individual coordinates with team members to assemble complex cooling systems and experimental racks required for sophisticated research and development (R&D) setups.
Beyond physical assembly, this position demands advanced software integration capabilities to support team-wide data objectives. The candidate develops custom programs-utilizing platforms such as LabVIEW or Python-to establish reliable communication with laboratory equipment. This programming is critical for the automated control and precise measurement of both the microelectronics and the associated cooling infrastructure during collaborative experimental cycles.
Additionally, the lead actively participates in microfabrication and advanced packaging processing in direct coordination with the Heterogeneous Integration (HI) team. As a core participant in the collaborative R&D cycle, the candidate analyzes experimental results and provides high-fidelity empirical data to team specialists to validate computational simulation models, ensuring the accuracy of the group's theoretical work.
Kbr · Beavercreek Township, OH