Additional Information
About Marvell
Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.
At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
Your Team, Your Impact
We are seeking a Staff Mechanical Design Engineer to join our Advanced Technology Infrastructure team, responsible for the mechanical architecture and detailed design of high performance semiconductor test infrastructures including sockets, optical connectors, silicon photonics FAUs, and thermal head assemblies. This role focuses on delivering mechanically robust, tolerance aware, and production ready designs that enable reliable electrical and thermal systems for next generation high power XPU and Silicon Photonics platforms.
You will lead mechanical design efforts spanning precision tolerance management, compliant mechanisms, fluid integrated structures, and scalable architectures, working closely with thermal, packaging, test, and manufacturing partners.
This position is ideal for an engineer who excels at turning complex mechanical constraints into elegant, manufacturable designs and enjoys driving hardware from concept through high volume deployment.
What You Can Expect
Own mechanical design and CAD development of test sockets, thermal heads, pedestals, handler design and loading mechanisms for high‑power semiconductor validation platforms
Participate in tolerance stack‑up analysis, managing TIM bond‑line thickness (BLT) and contact stack compliance to prevent die cracking, excessive contact resistance, and reliability degradation
FAU design, CPC connector design, Silicon Photonics Test infrastructure development
Develop compliant mechanical designs, including springs, flexures, and preload structures, to absorb socket manufacturing tolerances and handler misalignment
Design socket‑to‑thermal‑head integration features, ensuring precise alignment, mechanical stability, and repeatable contact under dynamic loading
Architect and detail loading and clamping mechanisms that deliver uniform pressure profiles while meeting handler, automation, and cycle‑time requirements
Design manufacturable internal fluid geometries, including micro‑channels and jet‑impingement manifolds, in collaboration with thermal engineering teams
Reduce DPPM through mechanical precision, owning pedestal planarity, flatness, and uniform pressure mapping across the device interface
Perform manufacturing‑focused tolerance and variation analysis, identifying sensitivity drivers and defining robust design margins
Integrate multi‑zone heaters, sensors, and wiring paths within compact assemblies while maintaining serviceability and mechanical integrity
Select CTE‑matched materials for sockets, pedestals, and structural components to minimize package and fixture warpage across temperature excursions
Develop modular, scalable CAD architectures and reusable design kits to enable rapid customization and high‑volume manufacturing deployment
Drive Design for Manufacturability (DFM) optimization, ensuring complex evaporator and fluid‑integrated geometries are cleanable, inspectable, and mass‑producible
Partner with manufacturing, reliability, and supply‑chain teams to define build processes, inspection methods, and production readiness criteria
Interface with external vendors on machining, surface finishing, coatings, and precision component fabrication
FAU design, CPC connector design, Silicon Photonics Test infrastructure development