Silicon Packaging Engineering Manager

Responsibilities

• Leadership and Management Lead and manage a group of IC Packaging Engineers, providing guidance, mentorship, and support to ensure the successful execution of projects.
• Oversee the planning, scheduling, and execution of package design projects, ensuring that milestones and deadlines are met.
• Foster a collaborative and innovative team environment, encouraging continuous learning and professional development.
• Lead design groups, coordinating efforts across multiple teams to achieve project goals.
• Technical Expertise Serve as the primary package design technical lead and guide customers through end-to-end package design flow
• Drive the development of advanced packaging designs, ensuring compliance with industry standards and best practices.
• Collaborate with cross-functional teams, including package architects, silicon and board design teams, design rule owners, electrical analysis engineers, and integration teams to define and implement design specifications.
• Leverage extensive experience in advanced packaging designs to meet design KPIs.
• Ensure products are designed and developed with high quality standards by overseeing design processes, risk management, and compliance throughout the product design lifecycle, working closely with cross-functional teams to identify and address potential quality issues before they arise.
• Project Management Develop and maintain detailed project plans, including resource allocation, risk management, and progress tracking.
• Coordinate with stakeholders to ensure alignment on project goals, deliverables, and timelines.
• Conduct regular project reviews and provide status updates to senior management.
• Innovation and Improvement
• Identify and implement process improvements to enhance the efficiency and quality of package designs and development.
• Stay current with industry trends and emerging technologies, incorporating new methodologies and tools into the design process.
• Drive innovation in product design, exploring new approaches and techniques to achieve competitive advantages.

Requirements

• Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
• Relevant experience should include the following: Experience in IC Package, chiplet/SOC design, or heterogenous integration, with at least 3 years in a leadership role.
• Proven experience in a leadership or management role, with a track record of successfully leading engineering teams and delivering complex projects within established timelines.
• Experience in performance/manufacturability/yield aware design methodologies
• Experience with design flows and methodologies (physical design, analysis, verification).
• Experience working with IC Packaging EDA tools from Siemens and/or Cadence.
• Experience with packaging technologies and heterogenous integration
• Experience with IC Packaging designs for HPC/AI class of products
• Join Intel and contribute to shaping the future of technology. Be a part of a dynamic team committed to delivering innovative solutions that address the needs of a rapidly evolving world. Apply today to take the next step in your career.
• Job Type:
• Experienced Hire
• Shift:
• Shift 1 (United States of America)
• Primary Location:
• US, Arizona, Phoenix
• Additional Locations:
• US, California, Santa Clara, US, Oregon, Hillsboro
• Business group:

Additional Information

Job Details: Job Description: Intel Foundry is seeking a highly experienced IC Packaging Design Manager to lead the delivery of advanced packaging solutions within the Advanced Design and Customer Engineering (ADCE) organization. You will lead a team responsible for driving package design execution to ensure first-pass success across customer programs. In this role, you will act as a trusted technical partner to customers, enabling successful adoption of Intel's advanced packaging technologies (EMIB, Foveros, chiplet architectures). This position requires technical depth, and leadership across all aspects of advanced packaging design.

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