Analyzing and improving end-to-end process yield, testing yield, and manufacturing efficiency; performing failure-mode analysis.
Supporting manufacturing operations by clarifying design requirements, predicting yields, and determining viability of nonconforming product, and by coordinating the smooth transition of development products into high-volume manufacturing.
Collaborating with the design organization to set up and oversee experiments involving wafer and chip fabrication.
Implementing software applications and overseeing database activities that support manufacturing.
Driving process control through SPC and quality system practices.
Using design of experiments (DOE) for process optimization and for the qualification of new processes and tools.
Process-engineering responsibilities (wafer fabrication or chip fabrication) depending on the needs of the business.
Qualifications and Skills :
Master's Degree in engineering, mathematics, or physical science, plus 6 years' experience in semiconductor manufacturing, or comparable combination of education and experience.
Preferred: Ph.D. in engineering, mathematics, or physical science, plus 3 years' experience in semiconductor manufacturing.
Significant experience with statistical analysis for semiconductor manufacturing.
Significant experience with using SQL queries for data mining, analysis, and presentation.
Significant experience with various software packages, including JMP and MS Office.
Willingness/ability to learn and use internally developed custom software.
Wafer-fabrication/chip-fabrication experience in a manufacturing environment.
Excellent written and oral communication skills.
Strong problem-solving ability; a mindset that is detail-oriented and analytical.
Perseverance, a positive attitude, and a bias toward action.
Preferred :
Knowledge and application of lean manufacturing methods.
Experience in the design and manufacture of reflective and anti-reflective coatings through ion-beam sputtering technology, including tool optimization.
About Broadcom Inc. and the Breinigsville Facility :
Additional Job Description:
Compensation and Benefits
The annual base salary range for this position is $108,000 - $172,800 .
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race
Benefits
Dental insuranceVision insurance401(k)Paid time offEquity / stock optionsPerformance bonus
Additional Information
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Job Description:
Breinigsville Wafer Fabrication, Lehigh Valley, Pennsylvania
In this full-time position with competitive pay and excellent benefits, the successful candidate will interface with departments throughout the company to facilitate the efficient and profitable manufacture of microelectronic laser and detector products that are critical to Broadcom's success as a leading manufacturer in the optoelectronics industry. The candidate will work energetically within a collaborative environment to optimize yields at diverse operations in the manufacturing process and will oversee development activities as well as new product introduction. Additionally, the candidate may assume responsibility for one or more fabrication processes depending on the needs of the business.
Broadcom · Usa-pennsylvania-breinigsville-9999 Hamilton Blvd