Mechanical Design Engineer - Power Modules and Power Packages

About the role

We are seeking a skilled and detail-oriented Mechanical Designer to join our Power Modules and Power Packages R&D team. The role focuses on the mechanical design and integration of advanced power modules and discrete packages, with a strong emphasis on assembly process compatibility, thermal management, reliability, and manufacturability. The ideal candidate will contribute to the development of next-generation solutions based on SiC and GaN technologies for traction and industrial applications.

Responsibilities

• Design mechanical structures for power modules and packages, including housings, substrates, interconnects, and cooling systems.
• Integrate mechanical design with assembly process requirements, including:
• Sintering (Ag or Cu)
• Gel-filling and potting
• Press-fit and soldering
• Wire bonding and clip bonding
• Encapsulation and molding
• Large area soldering / sintering
• Collaborate with process engineers to ensure mechanical designs are compatible with automated and semi-automated assembly lines
• Develop 3D CAD models and detailed drawings using tools such as SolidWorks, Inventor or CATIA
• Perform mechanical simulations (e.g., stress, vibration, thermal expansion) using FEA tools (e.g., ANSYS, COMSOL) is a nice to have
• Support prototyping, testing, and validation of mechanical designs in collaboration with internal labs and external partners
• Contribute to design-for-manufacturing (DFM) and design-for-reliability (DFR) initiatives
• Interface with suppliers and manufacturing teams to ensure feasibility and quality of mechanical components
• Document design processes, specifications, and test results in compliance with internal standards and industry regulations
• Coordinate and manage design documentation activities across the mechanical design team, ensuring proper document control, version management, release processes, and data consistency

Requirements

• Bachelor's or Master's degree in Mechanical Engineering or related field
• 3+ years of experience in mechanical design, preferably in power electronics or semiconductor packaging
• Proficiency in CAD and FEA tools
• Solid understanding of materials used in power electronics (metals, ceramics, polymers) and their mechanical/thermal properties
• Experience with assembly processe s relevant to power modules and packages
• Familiarity with thermal management techniques (e.g., heat sinks, TIMs, liquid cooling)
• Knowledge of reliability standards (e.g., JEDEC, IEC) and environmental testing
• Strong problem-solving skills and ability to work in cross-functional teams
• Fluent in English; Chinese would be a plus
• Available to travel for 25% of working time
• Preferred Skills
• Experience with SiC , GaN or IGBT -based power modules
• Background in traction or industrial applications
• Exposure to processes and manufacturing or advanced packaging technologies
• Knowledge of PCB design and integration

Benefits

Your Match

How well this role fits your profile.

Company Intel

What employees say

Worked at nexperia? Share your experience