Senior/Principal Equipment Engineer (Etch, Photo, Thin Film, Diffusion, PVD, WET)

Responsibilities

• Lead and ensure equipment performance in cleanroom environment for quality production.
• Handle on-duty tasks and conduct fundamental alarm troubleshooting; identify root cause and problem-solve critical equipment issues with urgency
• Install and qualify new tool sets on schedule to increase capacity promptly
• Continually improve tool uptime availability, drive defect reduction and enhance hardware capability
• Develop defense and monitoring system to prevent equipment failure or performance lost.
• Analyze complex data sets and derive actionable insights to optimize equipment parameters and controls
• Actively collaborate with equipment suppliers and partners to identify tool deficiencies; develop, evaluate, and validate corrective and preventive solutions
• Mentor junior engineers and technicians, fostering technical excellence, operational discipline, and continuous improvement.
• Education Qualification & Essential Experiences
• A bachelor's degree or higher in Electrical and Electronics Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or a related STEM field
• Minimum of 4 years of experience as any of the respective module equipment engineer, possessing in-depth knowledge.
• Experience working in a 12" fab would be advantageous
• Key Skills and Attributes
• Good interpersonal and communication skills to work effectively across functions and geographical teams with diverse background
• Strong analytical and problem-solving skills to achieve positive results and outcome
• Goal driven and an excellent team player that can work under pressure in a dynamic and fast-paced environment
• Has a growth mindset, prioritizing adaptability, resilience, innovation, and ongoing learning to support business needs
• VSMC promotes diversity and inclusivity in our workforce; and hiring will be conducted in phases.

Additional Information

About VSMC VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC), a joint venture between Vanguard International Semiconductor Corporation (VIS) and NXP Semiconductors (NXP) has started construction on a 300mm wafer manufacturing facility in Singapore, targets automotive, industrial, consumer, and mobile end markets. Role Summary You will be responsible and focused on improving tool performance and availability, in charge if maintenance, diagnosing failures and implementing effective solutions to meet uptime and cycle time requirements in the Etching (Dry Etch and Wet Etch); Photolithography; Metrology; Diffusion; Thin Film - Chemical Mechanical Planarization (CMP); Chemical Vapor Deposition (CVD); or Physical Vapor Deposition.

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