Package Development, Signal Integrity and Power Integrity Staff to Senior Staff Engineer

Requirements

• Bachelor's/Master's/PhD degree in Computer Science, Electrical Engineering or related fields and 5 - 10 years of related professional experience.
• Strong fundamentals in EM, transmission lines and microwave theory
• Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity
• Ability to manage package development involving various cross functional teams like assembly development, IC physical layout teams, Analog andDigital designers, marketing.
• Familiarity with IC package layout tools like APD or PADS
• Ability to automate the SI, PI and Packaging activities using scripting tools like Python.
• Working knowledge of circuit design tools: Spectre, ADS, HSpice
• Frequency domain and time domain knowledge of high speed signaling
• Experience with high-speed electronic packaging for digital and analog ICs
• Power plane design, modeling and analysis using tools like PowerSI, SIwave
• Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
• Understanding, debugging and simulations of EMI/EMC problems
• Track record of new product introduction from concept, through development and production is a plus.
• Knowledge of the thermal and mechanical analysis of the IC package development is a plus.
• Experience with channel simulations using MATLAB or ADS or other tools is a plus.
• A team player
• Strong communication, presentation, and documentation skills
• Experience with 2.5D/3D package development is highly desired.
• Additional Compensation and Benefit Elements
• All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.
• Interview Integrity
• To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

Additional Information

About Marvell Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact The Marvell packaging organization is responsible for supporting customers with advanced package designs that meet challenging electrical requirements.Many of the new designs are requiring multi-chip and multiple component configurations driving advanced technology requirements. What You Can Expect Marvell's Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advancedmicroelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrityaspects while considering manufacturing and assembly tolerances. The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements. The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.

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