Bachelor's degree in science and engineering major.
15+ years' experience in advanced node semiconductor industry in FEOL Process Integration.
15+ years' experience in advanced node semiconductor development or high-volume manufacturing.
Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics or Materials Science major is preferred.
Other related science and engineering degrees can be considered based on industry experience.
Experience in project/program management and advanced problem solving.
Demonstrated interpersonal skills including influencing, engaging, and motivating.
Experience in new semiconductor technology development.
Solid understanding and collaboration experience with module processes including lithography, dry etch, wet etch, CMP, thin films and metrology.
Job Type:
Experienced Hire
Shift:
Shift 1 (Ireland)
Primary Location:
Ireland, Leixlip
Additional Locations:
Business group:
Posting Statement:
Position of Trust
N/A
EU Salary
We offer a total compensation package that ranks among the best in the industry.
Annual Salary Range for this job which could be performed in Ireland is: €87,700.00 - €137,000.00
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site an
Additional Information
Job Details:
Job Description:
Customer Integration engineers' responsibilities include (but not limited to):
Critical Responsibility will be for identifying recurring patterns and learnings from customer engagements, abstracting these into foundry standards, systemising, automating and proliferating them across other technologies and customers.
Be the DRI (Directly Responsible Individual) to support customer improvement projects and respond to process issues on behalf of the customer.
Will be responsible for regular communication with the customer and from the customer to the factory.
Be the single point of contact for FEOL or BEOL process integration issues for customer.
Collaborate with Technology Development team to import new technology to Customer Products.
Work with FEOL/BEOL Integration, Device, Defect Reduction and Yield Analysis team members to identify root cause of yield/performance issues and implement mitigation plan in defined timeline to meet committed production yield/performance targets and to support fast paced yield ramp-up in high-volume manufacturing phases.
Own engineering projects to improve product yield, quality, performance and to reduce wafer cost.
Candidate should possess the following behavioural skills:
Problem-solving technique with strong self-initiative and self-learning capabilities.
Comfortable working with a high degree of autonomy
Ability to work with multi-functional, multi-cultural teams.
Must be highly organised with the ability to identify patterns from customer-specific issues, abstract key learnings, and systemise and proliferate best practices across teams and technologies.
Must demonstrate excellent communications skills and the ability to distil complex information in to easily understandable messages.
Must possess a high degree of ownership for problems with a high tolerance for ambiguity.
Intel · Leixlip, Ireland