Senior Engineer II, Process Engineering

Requirements

• Ph.D. degree in Physics, Physical Chemistry, Chemical Engineering, Materials Science, or a related field
• Minimum 10 years of experience in the semiconductor or semiconductor capital equipment industry
• Proven track record of developing and delivering new semiconductor process technologies to customers
• Strong working knowledge of semiconductor device physics and manufacturing processes
• Demonstrated credibility working with semiconductor fab managers, senior engineers, and executive stakeholders
• Ability to operate effectively in a fast-paced, results-oriented, and highly competitive environment
• Excellent communication skills in English; ability to collaborate in a global R&D environment
• Willingness to travel approximately 10-20%
• What sets you apart
• Deep expertise in ALD/PEALD, CVD/PECVD, including RF and/or microwave based
• Experience developing high‑thermal‑conductivity materials
• Track record generating patents or publications in thin‑film or thermal‑materials innovation
• Strong reputation for building high-performance, collaborative engineering cultures
• Experience influencing product direction through process innovation, materials engineering, and hardware collaboration
• Recognized thought leadership through patents, publications, or industry contributions
• Ability to balance technical innovation, customer satisfaction, and business priorities

Additional Information

Job's mission As a Senior Process Engineer at ASM, you will drive the development of high‑thermal‑conductivity thin films that enable next generation high‑performance computing (HPC) and advanced packaging. You'll lead a team of experts working on advanced thermal films compatible with rapidly evolving demands of advanced packaging and heterogenous integration, leveraging ALD/PEALD, CVD/PECVD, and related technologies to turn forward looking roadmaps into manufacturable solutions. By translating demanding customer requirements into breakthrough materials and processes, you'll help position ASM at the forefront of thermal management for heterogenous integration of advanced logic, foundry, and memory devices. What you will be working on Contribute to research development areas focused on high thermal conductivity thin films for advanced packaging and HPC applications, fostering innovation, technical excellence, and collaboration Own the roadmap to develop thermal films or materials aligned to customer performance and integration requirements. Leverage ASM's ALD/PEALD, CVD/PECVD, and surface preparation expertise to design, optimize, and qualify high thermal conductivity materials and stacks for use in advanced devices and packages. Drive high thermal conductivity thin film development, including process optimization for deposition rate, uniformity, materials properties, morphology and bondability. Define, influence, and drive new hardware requirements and development in close collaboration with hardware and software engineering teams to meet advanced on high thermal conductivity process specifications and integration schemes. Collaborate closely with customers, Account Technology Directors, Product Management, and Business Development to align on high thermal conductivity materials roadmaps with customer device and packaging strategies. Partner with corporate and global R&D organizations to deliver new materials, surface preparation schemes, and applications that support critical technology inflections in thermal management and advanced packaging. Ensure generation and protection of intellectual property and technical publications. Stay at the forefront of state‑of‑the‑art semiconductor processing and thermal management technologies, maintaining strong technical communication with industry peers and key customers. Communicate at a highly technical level with end customers to build trust in ASM's ability to solve their most advanced thermal and device challenges.

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Company Intel

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