Engineer for TAK ICP dry etching process

Responsibilities

• Develops new or modified InP-based Lithography process, defines etching condition or handling equipment requirements and specifications, and contributes by applying the developed technologies in the manufacture, fabrication, and evaluation of products.
• Responsible for introducing new Dry etching or Auto wet etching process equipment and setting up etching process conditions to realize mass-production capacity ramp.
• Involvement may begin at any step from pilot plant to full-scale manufacturing.
• May conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes.
• Expected Background:
• BSc, MSc, PhD degree in electronics, electrical engineering, physics, or a related equivalent technical field.
• Bachelors and 2+ years of work experience, Masters and 1+ years of work experience. PhD. no relevant work experiences.
• Expected Skill:
• In optical semiconductor wafer processing, experience in process improvement using Dry etching or Auto wet etching equipment and wafer process production technology is required. Practical experience in lithography, oxide film deposition, sputtering, metal deposition is even better.
• On-time mindset
• Fluent Japanese speaker and business level English skill including managing and discussion in on-line meeting, email communications, and documentation in English.

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Company Intel

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