Mechanical & Thermal Staff Engineer

About the role

Axelera AI is not your regular deep-tech startup. We are creating the next-generation AI platform to support anyone who wants to help advancing humanity and improve the world around us. In just four years, we have raised a total of $370 million and have built a world-class team of 220+ employees (including 49+ PhDs with more than 40,000 citations), both remotely from 18 different countries and with offices in Belgium, France, Switzerland, Italy, the UK, headquartered at the High Tech Campus in Eindhoven, Netherlands. We have also launched our Metis™ AI Platform, which achieves a 3-5x increase in efficiency and performance, and have visibility into a strong business pipeline exceeding $100 million. Our unwavering commitment to innovation has firmly established us as a global industry pioneer. Are you up for the challenge? Position Overview We are looking for a Staff Mechanical & Thermal Engineer to lead the development of cooling solutions for our AI accelerator cards and platforms based on Axelera's processors, targeted at the full spectrum from edge devices to high-performance computing (HPC) platforms. Typical products include PCIe accelerator cards, M.2 form-factor modules, OEM single board computer. The role has two clear missions: - Lead the design of Axelera's AI accelerator cards and platforms, ensuring mechanical fit and thermal performance from concept to production hand-off, owning both in-house design and the technical management of external suppliers for outsourced cooling solutions. - Test and validate the cooling solution end-to-end, including thermal simulation, simulation-to-test correlation, lab execution, and characterisation reporting suitable for senior management, suppliers, and customers. You will own the cooling-solution life-cycle from concept and structured trade-off analysis through validation and production hand-off, in close collaboration with industry partners, OEM customers, and external suppliers. The following domains are not relevant for this role: HVAC, automotive/aerospace thermal, additive manufacturing simulation, and pure research roles.