TW_Power Packages Development Engineer (Power Module)

Responsibilities

• Define & drive milestones: Establish major package‐development milestones and ensure on-time delivery through proactive planning, progress tracking, and risk mitigation.
• Design coordination: Coordinate package design and process development for discrete power packages and power modules in collaboration with internal engineering teams and external suppliers.
• Process engineering: Develop and optimize assembly processes in collaboration with assembly partners for discrete power packages and power modules in automotive applications.
• Sample build & qualification: coordinate oversee sample manufacturing and process qualification at assembly partners.
• Cross-functional collaboration: Communicate and work effectively in English with international stakeholders across product engineering, supply chain, and quality teams.
• Coordination: align with interdisciplinary teams within development and release of discrete power packages and power modules.
• Experience: 3-8 years in semiconductor packaging/assembly.
• Technical expertise: Strong background in semiconductor assembly technologies and materials. Experience with SiC packages and high voltage power modules is a plus.
• Project management: Proven ability in milestone tracking, reporting, systematic problem solving, multi-task handling and customer communication.
• Global teamwork: Demonstrated success in multicultural, international projects.
• Adaptability: Agile in adjusting project plans to evolving technical requirements and customer needs.
• Problem solving: ability to use well-established methods (8D, Fishbone, etc ) to solve technical issues.
• Language & mobility: Excellent English skills (verbal and written); willingness to travel as required.

Additional Information

We are seeking a motivated and technically skilled Power Packages Development Engineer.

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Company Intel

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