At least a Bachelor's degree in Computer Science, Electrical Engineering or related fields and 5-10 years of related professional experience OR a Master's degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3-5 years of experience.
Strong fundamentals in EM, transmission lines and microwave theory
Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity
Frequency domain and time domain knowledge of high speed signaling
Ability to automate the SI, PI and Packaging activities using scripting tools like Python.
Experience with high-speed electronic packaging for digital and analog ICs
Power plane design, modeling and analysis using tools like PowerSI, SIwave
Working knowledge of circuit design tools: Spectre, ADS, HSpice
Understanding, debugging and simulations of EMI/EMC problems
Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
Ability to manage package development involving various cross functional teams like assembly development, IC physical layout teams, Analog and Digital designers, marketing.
Familiarity with IC package layout tools like APD or PADS
Experience with 2.5D/3D package development is highly desired.
Experience with CPC/CPO connectors is highly desired.
Experience with channel simulations using MATLAB or ADS or other tools is a plus.
Track record of new product introduction from concept, through development and production is a plus.
Knowledge of the thermal and mechanical analysis of the IC package development is a plus.
A team player
Strong communication, presentation, and documentation skills
Expected Base Pay Range (USD)
142,700 - 211,230, $ per annum
The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.
Additional Compensation and Benefit Elements
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, nation
Benefits
Health insuranceEquity / stock options
Additional Information
About Marvell
Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.
At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
Your Team, Your Impact
Group Description
Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, Marvell's innovative technologies enable new possibilities and power the next generation of performance‑driven systems.
Within this ecosystem, Marvell's central advanced packaging organization plays a critical role in delivering next‑generation connectivity and compute products. The organization brings deep expertise in architecture, package design, and electrical performance, including SI/PI to develop advanced IC packages that support high‑speed interfaces. This work directly shapes product performance, reliability, and time‑to‑market, making it a key contributor to Marvell's overall technology leadership.
What You Can Expect
Marvell's Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects. The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements. The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.
Marvell · Austin, TX