Semiconductor Process Engineering - Wet Etch & CMP
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Responsibilities
- Develop and own wet etch and CMP processes in production
- Drive process stability, yield improvement, defectivity reduction, capability enhancement and cost down projects of varying scope and complexity, both as team lead or as part of a larger team
- Investigate and resolve process excursions, particle issues and reliability concerns using structured root cause analysis techniques (8D, FMEA etc)
- Lead process qualification and change management activities
- Provide technical input to new product introductions (NPI) and technology transfers
- Define and maintain process specifications, control plans, SPC methodologies and documentation
- Engage with tool vendors to progress drive tool installs and performance improvements
- Mentor and technically support junior engineers where appropriate
- Required Qualifications & Experience
- Degree (or equivalent experience) in Materials Science, Chemical Engineering, Physics or related discipline
- Practical experience as a process engineer in a semiconductor wafer fab or comparable high‑tech manufacturing environment
- Personal Attributes
- Strong analytical and problem‑solving skills
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Company Intel
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