Lead the technical management and decision making for facet coating and related backend operations, including wafer scribing, laser bar handling, and Automated Visual Inspection (AVI).
Design complex multilayer interference coatings (AR, HR, and passivation layers) and develop/optimize deposition recipes using IBS (Ion Beam Sputtering)
Utilize spectroscopic ellipsometry, spectrophotometry, and AFM to verify film thickness, refractive index, and surface roughness
Act as the primary technical point of contact for equipment suppliers; defining requirements for new tool acquisitions and engineering upgrades.
Manage subcontractor manufacturers across different regions, implementing remote monitoring to ensure consistent performance across all coating processes.
Lead the buyoff and qualification of new coating systems to support production scaling, collaborating closely with Product, Quality, and R&D teams.
Drive New Process Integration (NPI) and formal process transfers from the design phase to high-volume manufacturing.
Optimize batch sizes "load-lock" cycling, fixtures density to maximize output without compromising quality
Perform deep-dive root cause analysis and implement robust Corrective and Preventive Actions (CAPA) for any process excursions and eliminate sources of defects.
Define comprehensive process control plans, Statistical Process Control (SPC) strategies, FMEA and Out-of-Control Action Plan (OCAP) execution.
Partner with equipment, integration, quality, and R&D teams, as well as external foundries, to align technical goals and operational strategies.
Utilize statistical data analysis to identify yield detractors coating, thickness, defects, Equipment utilizations and operations efficiency.
Establish dashboards and KPIs to track the health of facet coating processes; monitor daily performance, Cycle time and flag critical issues immediately. Summarise periodical reports to management
Create and maintain Standard Operating Procedures (SOPs), technical reports, change management documents, and data analysis for all facet-coating related backend processes.
Lowering the cost-per-die through process efficiency and recipe optimization
Requirements
Bachelor's or Master's in Engineering (Physics, Materials Science, Optical, Chemical or Electrical Engineering).
5-15 years of experience in semiconductor wafer fab or backend processes, with at least 5 years of hands-on experience in thin-film deposition specifically for optoelectronic devices
Understanding of vacuum physics and deposition techniques (IBS, ALD), dielectric coating materials (e.g., Al2O3, SiO2, Ta2O5, TiO2, Si3N4 )
Strong statistics fundamentals and knowledge of SPC, DOE, FMEA, DMAIC, and advanced statistical tools such as JMP, visualization tools such as Tableau, SQL
Experience with automated bar-handling, wafer scribing and cleaving, Pick-and-Place (PnP), AVI tools, Burn-in and fundamental mechanical engineering concepts.
Strong knowledge of laser (DFB, EML & VCSEL) manufacturing principles, using InP (Indium Phosphide), GaAs (Gallium Arsenide)materials
Energetic leader with excellent interpersonal skills, Presentation skills; ability to remain resilient and adapt in high-stress, fast-paced environments.
JMP Scripting and programming skills for data analysis and reporting automations
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Benefits
Health insurancePaid time offRemote work options
Additional Information
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Job Description:
Job Summary
Owns the end-to-end facet coating process for laser devices, characterization, driving productivity, yield, quality, and reliability across internal lines and subcontractor facilities. This role manages capacity expansion through the buyoff and qualification of new coaters while ensuring a seamless transition from R&D to high-volume manufacturing (HVM). You will serve as the technical authority for coatings, monitoring subcontractor operations to ensure shipment commitments are met.
Broadcom · Singapore-depot Road