Sr Hardware Test and Packaging Engineer

Responsibilities

• Design, Develop and Support
• Work as part of platform team that develops tools and components for high-volume manufacturing to support, debug and improve tools and processes
• Analyze data from Cisco's automated packaging tools/processes to shape new projects targeting improvements in Cisco-designed high-volume manufacturing platforms
• Recommend and implement test/assembly/process improvements, including cycle time reduction, and identify improvements required to maximize systems throughput and quality.
• Design, build, and test prototypes of complex electromechanical assemblies to be used in automated manufacturing tools.
• Diagnostics Development & Lifecycle Management
• Follow new tools, processes and components from development to production to ensure successful integration of new platform technologies.
• Devise and perform complex tests needed during FA as part of development and continuous improvement.
• Apply data analytics leveraging AI/ML for proactive problem detection and resolution
• Ensure high standards of reliability, quality, and efficiency in all diagnostic work.
• Collaboration & Team Development
• Partner with hardware, software, manufacturing, and product engineering teams to ensure alignment and successful program delivery.
• Develop and execute project plans with predictability, quality and velocity.
• Collaborate and travel to assure successful product deployment across a global environment

Requirements

• Bachelors + 8 years of related experience, or Masters + 6 years of related experience, or PhD + 3 year of related experience.
• Experience with photonic test or photonic assembly in a manufacturing environment
• Ability to travel internationally to support projects/internal customers in theater
• Experience in hardware/software automation of photonics assembly/test.
• Data analysis (SQL/JMP) in a semiconductor production environment
• Knowledge of photonics, fiber optics and semiconductor lasers
• Why Cisco?
• We are Cisco, and our power starts with you.
• Message to applicants applying to work in the U.S. and/or Canada:
• The starting salary range posted for this position is $134,300.00 to $195,400.00 and reflects the projected salary range for new hires in this position in U.S. and/or Canada locations, not including incentive compensation*, equity, or benefits.
• U.S. employees are eligible for paid time away as described below, subject to Cisco's policies:
• 10 paid holidays per full calendar year, plus 1 floating holiday for non-exempt employees
• 1 paid day off for employee's birthday, paid year-end holiday shutdown, and 4 paid days off for personal wellness determined by Cisco
• Non-exempt employees** receive 16 days of paid vacation time per full calendar year, accrued at rate of 4.

Benefits

Additional Information

The application window is expected to close on: 06/30/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received . Meet the Team As Hardware Test & Packaging Engineer, you will help develop and support Cisco's next generation component and packaging platform for Cisco's Silicon Photonics Integrated Circuits and chipsets. As a member of the platform team (engineering), you'll be responsible for improving and supporting high-volume, automated optical assembly and test processes.

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