IC Package Integration Lead

About the role

- Work with cross-functional teams and lead package integration and architecture efforts. - Work with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs. - Work to bring innovative packaging solutions from concept to mass production, including package, module, and technology development. - People managerial skills highly desirable. - Travel - 5-10%","responsibilities":"Lead package co-design efforts with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical, thermal, reliability and fit requirements. Drive package technology development which has broad impact (new technology, structure development, enhanced performance, lower cost) Co-work with assembly partners on new packages from development, NPI, Qualification to high volume production. Create package design documentation, design rules, technical risk assessment, package checklist for Silicon TO, Development and release to production teams.