Physical Design Engineer

About the role

As a member of our tight knit physical design team, you will be working on the design and analysis of 3D integrated products. This role involves a combination of traditional ASIC/SoC physical design skills, packaging, power, clock and cooling analysis. You will work closely with the architecture and RTL team to do R&D on novel concepts for 3D integration.

Requirements

• Required
• 10+ years of physical design/verification experience.
• Strong knowledge of block level and full-chip physical verification methodology.
• Expert at optimizing for the best power/performance and area.
• Experience with the complete physical design flow. Knowledge of Synopsys tool suite is a plus.
• Expert with ICV or Calibre tools resolving block and full-chip DRC and LVS issues.
• Expert with IR/EM analysis and resolution.
• Strong ability in scripting languages like Tcl and Python. Ability to make flow enhancements.
• Demonstrated ability to work with RTL teams to optimize for physical design.
• Knowledge of 2.5D or 3D packaging solutions.
• Must have experience with 3d physical design, 3d die stacking, 3d chip design, die-to-die or wafer-to-wafer.
• Preferred
• Experience doing full chip floor planning and integration.
• Knowledge of clock distribution.
• Knowledge of cooling analysis.
• The salary range for this position is $230,000 - $280,000 annually. Actual compensation will be determined based on factors such as experience, skills, qualifications, and location.
• Why Join Cerebras
• Build a breakthrough AI platform beyond the constraints of the GPU.
• Publish and open source their cutting-edge AI research.
• Work on one of the fastest AI supercomputers in the world.
• Enjoy job stability with startup vitality.
• Our simple, non-corporate work culture that respects individual beliefs.
• Read our blog: Five Reasons to Join Cerebras in 2026.
• Apply today and become part of the forefront of groundbreaking advancements in AI!
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Additional Information

Cerebras Systems builds the world's largest AI chip, 56 times larger than GPUs. Our novel wafer-scale architecture provides the AI compute power of dozens of GPUs on a single chip, with the programming simplicity of a single device. This approach allows Cerebras to deliver industry-leading training and inference speeds and empowers machine learning users to effortlessly run large-scale ML applications, without the hassle of managing hundreds of GPUs or TPUs. Cerebras' current customers include top model labs, global enterprises, and cutting-edge AI-native startups. OpenAI recently announced a multi-year partnership with Cerebras , to deploy 750 megawatts of scale, transforming key workloads with ultra high-speed inference. Thanks to the groundbreaking wafer-scale architecture, Cerebras Inference offers the fastest Generative AI inference solution in the world, over 10 times faster than GPU-based hyperscale cloud inference services. This order of magnitude increase in speed is transforming the user experience of AI applications, unlocking real-time iteration and increasing intelligence via additional agentic computation.

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