Minimum a Master's degree in Chemical Engineering, Materials Science, Physics, Mechanical Engineering, Electrical Engineering or related field.
Hands-on research experience with thin-film deposition processes such as ALD, CVD, PECVD, or PVD.
Strong experimental background, including designing experiments and analyzing complex data sets.
Solid problem-solving and analytical skills, with a structured approach to research challenges.
Clear written and verbal communication skills, with the ability to explain technical concepts to diverse audiences.
Curiosity, initiative, and motivation to apply academic research in an industrial setting.
Strong understanding of electro/mechanical equipment and software systems
What sets you apart
Research experience related to advanced packaging, interconnects, or semiconductor manufacturing
Familiarity with statistical methods, DOE tools, or data modeling techniques.
Experience with materials characterization methods such as SEM, TEM, XRD, or ellipsometry.
Exposure to cross-disciplinary or collaborative research environments.
Interest in long-term growth within semiconductor technology development and process engineering.
Apply today to be part of what's next.
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Additional Information
Step into a career with ASM, where cutting edge technology meets collaborative culture.
For over 55 years ASM has been ahead of what's next, at the forefront of innovation and what's technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we're more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.
Job's mission
As a Senior / Process Engineer in Advanced Packaging, you will bring your research experience into an industrial R&D environment, contributing to the development of semiconductor process technologies used in next-generation devices. Working closely with experienced engineers and scientists, you will translate scientific insight into scalable, manufacturable solutions. Your work will directly support ASM's mission to enable the chips that power today's most advanced technologies.
What you will be working on
Contribute to the research, development, and optimization of semiconductor processes for Advanced Packaging, including thin-film deposition (ALD, PECVD, PVD, ECP) and surface preparation technologies.
Design, execute, and analyze experiments using DOE-based approaches, supported by senior technical experts.
Perform materials and process characterization to evaluate film quality, reliability, and performance.
Analyze experimental data and clearly document results in technical reports and internal presentations.
Collaborate with cross-functional teams across R&D, process engineering, and applications.
Support troubleshooting of process or equipment issues in laboratory and pilot environments.
Participate in technology reviews and contribute ideas to process improvement and innovation initiatives.
Learn industry best practices for transitioning processes from development into customer and manufacturing environments.
Asm · Singapore