Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; regularly assess the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
Partner with Process Engineering during new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
Collaborate with cross-functional teams to develop, maintain, and update technical documentation, including control plans, process specifications, SOPs, FMEAs, and technical reports.
Plan and manage technician headcount coverage to support 24/7 operations; delegate tasks effectively and provide clear, transparent updates.
Mentor and coach technicians to enhance technical capability and engineering mindset, including KPI setting and annual performance evaluations.
Work closely with R&D, NPI, Product Design, and Reliability teams to align trim and form equipment capability with package architecture and process requirements.
Diagnose and resolve trim and form equipment, tooling, and process-related defects impacting yield and product quality.
Support technology, process, and equipment transfers and ensure smooth ramp-up to HVM.
Contribute to process technology roadmaps supporting advanced packaging, thin form factors, and emerging device architectures.
Drive continuous improvement initiatives such as MVA, yield enhancement, and UPH optimization.
Manage spare parts inventory, procurement activities, and cost optimization initiatives.
Liaise with suppliers and vendors for tooling, jigs, and fixtures; closely monitor delivery schedules for spare and non-spare items.
Perform effectively in a fast-paced, dynamic manufacturing environment.
Requirements
Bachelor's degree in engineering or a related technical discipline.
Minimum 5 years of experience in the semiconductor industry, with at least 3 years specializing in trim and form equipment and tooling .
Strong hands-on experience with trim and form machines used in semiconductor packaging.
Solid understanding of tooling design , material properties and behavior, GD&T , tolerances, and metrology equipment (added advantage).
Proficiency in statistical analysis tools such as JMP and Minitab , with strong technical documentation skills.
Proven leadership capability with experience guiding technicians in a 24/7 manufacturing environment.
Strong analytical, problem-solving, and cross-functional communication skills.
In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.
Additional Information
As a Senior Equipment Engineer (Trim & Form) , you will be responsible for driving equipment reliability, performance, and continuous improvement of trim and form operations in a high-volume semiconductor manufacturing environment. This role combines strong equipment engineering leadership with solid process and tooling knowledge to support new product introductions, yield improvement, and advanced packaging technologies. You will work closely with cross-functional teams.
Nexperia · Seremban