Master's degree in Mechanical Engineering, Materials Science and Engineering, Chemical Engineering, Applied Physics, or Electrical Engineering is required with 1-5 years of industrial working experience in related fields.
Knowledge in various packaging technologies, process flow, material, qualification, and manufacturing implementation.
Knowledge in IC package reliability requirements, failure analysis techniques, assembly process issues, etc.
EEO is the Law: Notice of Applicant Rights Under the Law .
Job Req Type: Experienced
Required Travel: Yes, 10% of the time
Shift Type: 1st Shift/Days
The expected wage range for a new hire into this position is $86,480 to $118,910. Actual wage offered may vary depending on work location , experience, education, training, external market data, internal pay equity, or other bona fide factors.
This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time , and other benefits.
Benefits
Health insuranceDental insuranceVision insurance401(k)Paid time offEquity / stock optionsPerformance bonusParental leave
Additional Information
About Analog Devices
Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X .
Job duties include but not limited to:
New Product Introduction (NPI): New product package development from design through qualification up to release of the product to production. Development of new module package technologies working closely with the product design engineers and the factories.
Business Unit (BU) communications: Communicate with design teams to understand the package requirements and to influence package-related design decisions for new product development.
Assembly subcontractor/OSATs communications: work closely with ADI's overseas assembly subcontractor/OSATs for new package development and other package-related engineering activities. Late afternoon/early evening conference calls and oversea travels are expected.
Cross functional team collaborations: work closely with reliability team, business units, and supply chain management team to provide package-related engineering support.
Project management: plan and drive for on time delivery of development projects.
Package bill of material (BOM) selection: solid understanding of mechanical, thermal, and electrical properties of materials, including semiconductors, metals, ceramics, and polymer composites.
Package Design Rules: Develop and implement package design rules and other specifications for module assembly processes.
Package model and drawing creation: Create package design models and drawings for package development, simulation, and documentation.
Package process development: Develop materials, assembly processes, process control plans with material suppliers, assembly vendors during NPI. Perform process failure mode and effects analysis (FMEA), execute design of experiments (DOE), implement process change notification (PCN)
Finite element analysis: experience in finite element analysis (thermal, stress, and electrical) is plus.
Analog Devices · CA, San Jose, Rio Robles