Perform package and die level failure analysis of customer returns and internal failures. (60%)
Generate formal FA reports for customers and internal requestors to summarize and communicate the technical analysis results. (15%)
Work with various engineering teams such as QA & Reliability, Design, Applications, Wafer Fab, Assembly, Product and Test Engineering as appropriate, for root cause analysis and resolution of customer and internal issues. (15%)
Participate in continuous FA technique development and process improvements, monitoring and maintenance of laboratory supplies and consumables, optimization and maintenance of laboratory tools and equipment. (10%)
Requirements
Bachelor's degree in Engineering Physics, Electrical or Electronics Engineering.
At least 3 years experience in semiconductor IC Failure Analysis.
Must have hands-on experience in operating the following FA equipment: Curve Tracer/Parametric Analyzer, Scanning Acoustic Microscope, SEM/EDX, Photon Emission/Laser Signal Injection Microscope, Microprober.
Must have hands-on experience in performing the following physical FA steps: chemical decapsulation/deprocessing/staining, mechanical/parallel lapping, mechanical cross-sectioning and polishing.
Proficient in bench testing and instrumentation.
Knowledge in IC fabrication, semiconductor physics, BJT and MOSFET theories and basic circuit configurations.
Strong verbal and written communication skills, analytical and problem solving skills, teamwork and cross-functional team coordination.
Willing and able to work non-traditional hours as needed to meet urgent customer requests - for example, weekend support to address time-sensitive customer needs.
Willing and able to work in a laboratory environment onsite.
Proficient in MS Word, PowerPoint and Excel.
Experience in FIB X-sectioning, Circuit Edit and ion milling techniques.
Additional experience in the following engineering disciplines: Product Quality and Reliability, Test/Product Engineering, Design/Validation/Characterization, Applications, and Wafer Fab.
The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.
All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.
Additional Information
Location : Burlington, ON. (On-Site)
The Staff Failure Analysis Engineer is responsible for performing package and die level failure analysis of analog and mixed signal ICs from customer returns and internal failures. Internal failures may include rejects from Quality and Reliability Qualification, Test Manufacturing Line, Design and New Product Characterization failures, etc. Results of the analysis must be documented through a formal technical report.
Semtech · Can - Burlington, On, Canada